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  • Chemical composition C Si Mn P S Ni Cr Mo
    SUS304 JIS Value ≤0.08 ≤1.00 ≤2.00 ≤0.040 ≤0.030 8.00~11.00 18.00~20.00 -
    SUS316 JIS Value ≤0.08 ≤1.00 ≤2.00 ≤0.040 ≤0.030 12.00~14.00 16.00~18.00 2.00~3.00
    SUS316L JIS Value ≤0.030 ≤1.00 ≤2.00 ≤0.040 ≤0.030 12.00~16.00 16.00~18.00 2.00~3.00
    TP316L ASTM A269 ≤0.035 ≤0.75 ≤2.00 ≤0.040 ≤0.030 10.00~15.00 16.00~18.00 2.00~3.00
    Double Melting ≤0.02 ≤0.5 ≤0.05 ≤0.04 ≤0.003 14.50~16.00 16.00~18.00 2.20~3.00
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  • Grade Size Inner surface roughness Hardness(Hb)
    Ra(μinch)
    BA 1/4" ≤ OD ≤ 1" ≤20 ≤90
    25 ≤ OD ≤ 100A ≤25
    EP 1/4" ≤ OD ≤ 80A ≤10(≤7)
    OD ≥ 100A
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  • Grade Particle(Number/CFM) Oil content Dew point
    0.1㎛ 0.3㎛
    BA ≤5 0 ≤0.01mg/ft2 ≤-75℃
    EP ≤1 0 ≤0.01mg/ft2 ≤-75℃
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  • SECTION YIELD STRENGTH
    (N/mm²)    		 TENSILE STRENGTH
    (N/mm²)    		 ELONGATION
    (%)
    Semiconductor
    / LCD    		 SUS304TP Standard
    		 205 over 520 over 35 over
    SUS316TP Standard
    		 205 over 520 over 35 over
    SUS316LTP Standard
    		 175 over 480 over 35 over
    Bio
    / Pharmaceutical
    /Food processing plant　    		 SUS304TBS Standard
    		 - 520 over 62 over
    SUS316LTBS Standard
    		 - 480 over 35 over
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